Light emitting bulb

ABSTRACT

This disclosure discloses a light-emitting bulb. The light-emitting bulb includes a cover, an electrical associated with the cover, a board arranged between the cover and the electrical connector, and a first light-emitting device disposed on the board. The first light-emitting device includes a carrier having a first side and a second side, a first electrode part disposed near the first side and extending to the second side, a bended part disposed near to the second side and spaced apart from the first electrode part, and a second electrode part extending from the bended part to the first side. No light-emitting diode unit is arranged on the second electrode part.

REFERENCE TO RELATED APPLICATION

This present application is a continuation application of U.S. patentapplication Ser. No. 14/301,606, filed on Jun. 10, 2014, now U.S. Pat.No. 9,664,340, issued May 30, 2017, which claims the right of prioritybased on TW application Serial No. 102120893, filed on Jun. 11, 2013.The entire contents of the applications are hereby incorporated byreference.

BACKGROUND

Technical Field

The present disclosure relates to a light-emitting bulb, and inparticular to a light-emitting bulb with an omnidirectional lightpattern.

Description of the Related Art

The light-emitting diodes (LEDs) of the solid-state lighting elementshave the characteristics of low power consumption, low heat generation,long operational life, shockproof, small volume, quick response and goodopto-electrical property like light emission with a stable wavelength sothe LEDs have been widely used in household appliances, indicator lightof instruments, and opto-electrical products, etc. As theopto-electrical technology develops, the solid-state lighting elementshave great progress in the light efficiency, operation life and thebrightness, and LEDs are expected to become the main stream of thelighting devices in the coming future. However, in some application,there is a need to have a light-emitting apparatus with anomnidirectional light pattern which is not available using theconventional light emitting apparatus.

It is noted that the LEDs can be further connected to other componentsin order to form a light emitting apparatus. For example, the LEDs isdisposed on a submount, and then on a carrier. Alternatively, a solderor an adhesive is formed between the LEDs and the carrier to form thelight emitting apparatus. In addition, the carrier can further includeelectrode for electrically connecting to the LEDs.

SUMMARY OF THE DISCLOSURE

The present disclosure provides a light-emitting bulb with anomnidirectional light pattern.

This disclosure discloses a light-emitting bulb. The light-emitting bulbincludes a cover, an electrical associated with the cover, a boardarranged between the cover and the electrical connector, and a firstlight-emitting device disposed on the board. The first light-emittingdevice includes a carrier having a first side and a second side, a firstelectrode part disposed near the first side and extending to the secondside, a bended part disposed near to the second side and spaced apartfrom the first electrode part, and a second electrode part extendingfrom the bended part to the first side. No light-emitting diode unit isarranged on the second electrode part.

BRIEF DESCRIPTION OF THE DRAWING

The accompanying drawings are included to provide easy understanding ofthe application, and are incorporated herein and constitute a part ofthis specification. The drawings illustrate the embodiments of theapplication and, together with the description, serve to illustrate theprinciples of the application.

FIGS. 1A and 1B illustrate a perspective view of a light-emitting devicein accordance with one embodiment of the present disclosure.

FIG. 1C illustrates a perspective view of a light-emitting device inaccordance with another embodiment of the present disclosure, showing aconductive connecting connector formed on a side of a carrier.

FIG. 2A illustrates a top view of a light-emitting device in accordancewith one embodiment of the present disclosure.

FIG. 2B illustrates a cross-sectional view taken along from line I-I′ ofFIG. 2A.

FIG. 3A illustrates a top view of a light-emitting device in accordancewith one embodiment of the present disclosure.

FIG. 3B illustrates a cross-sectional view taken along from line II-II′of FIG. 3A.

FIG. 4A illustrates a top view of a light-emitting device in accordancewith another embodiment of the present disclosure.

FIG. 4B illustrates a top view of a light-emitting device in accordancewith another embodiment of the present disclosure.

FIG. 4C illustrates a top view of a light-emitting device in accordancewith another embodiment of the present disclosure.

FIG. 4D illustrates a bottom view of the light-emitting device of FIG.4C.

FIG. 4E illustrates a top view of a light-emitting device in accordancewith another embodiment of the present disclosure.

FIG. 4F illustrates a top view of a light-emitting device in accordancewith another embodiment of the present disclosure.

FIG. 4G illustrates an equivalent circuit of the FIG. 4F.

FIG. 5A illustrates a cross-sectional view of a light-emitting device inaccordance with another embodiment of the present disclosure.

FIG. 5B illustrates a top view of the light-emitting device of FIG. 5A.

FIG. 5C illustrates a bottom view of the light-emitting device of FIG.5A.

FIG. 5D illustrates a cross-sectional view of a light-emitting device inaccordance with another embodiment of the present disclosure.

FIG. 5E illustrates a top view of the light-emitting device of FIG. 5D.

FIGS. 6A and 6B illustrate cross-sectional views of a light-emittingdevice in accordance with another embodiment of the present disclosure.

FIG. 6C illustrates a top view of the light-emitting device of FIGS. 6Aand 6B.

FIGS. 6D and 6E illustrate top and bottom views of an electrical plateembodied in the light-emitting device of FIGS. 6A and 6B.

FIG. 7A illustrates a cross-sectional view of a light-emitting diodeunit in accordance with one embodiment of the present disclosure.

FIG. 7B illustrates a cross-sectional view of a light-emitting diodeunit in accordance with another embodiment of the present disclosure.

FIG. 7C illustrates a cross-sectional view of a light-emitting diodeunit in accordance with another embodiment of the present disclosure.

FIG. 7D illustrates a cross-sectional view of a light-emitting diodeunit in accordance with another embodiment of the present disclosure.

FIG. 8A illustrates a cross-sectional view of a light-emitting diodeunit in accordance with another embodiment of the present disclosure.

FIG. 8B illustrates a cross-sectional view of a light-emitting diodeunit in accordance with another embodiment of the present disclosure.

FIG. 8C illustrates a partial cross-sectional view of the light-emittingdiode unit of FIG. 8A embodied in FIG. 5A.

FIG. 8D illustrates a cross-sectional view of a light-emitting diodeunit in accordance with another embodiment of the present disclosure.

FIG. 8E illustrates a correlated color temperature spatial distributionof light emitted from a light-emitting diode unit in accordance withanother embodiment of the present disclosure.

FIG. 9 illustrates a cross-sectional view of a light-emitting device inaccordance with another embodiment of the present disclosure.

FIG. 10A illustrates a perspective view of an LED bulb in accordancewith one embodiment of the present disclosure.

FIG. 10B illustrates a top view of a circuit board on which alight-emitting device is mounted in accordance with one embodiment ofthe present disclosure.

FIG. 11A illustrates a perspective view of an LED bulb in accordancewith one embodiment of the present disclosure.

FIG. 11B illustrates a top view of FIG. 11A.

FIG. 11C illustrates a top view of a circuit board on which alight-emitting device is mounted in accordance with one embodiment ofthe present disclosure.

FIG. 11D illustrates a perspective view of an LED bulb in accordancewith one embodiment of the present disclosure.

FIG. 11E illustrates a top view of FIG. 11D without a cover.

FIG. 11F illustrates a perspective view of an LED bulb in accordancewith one embodiment of the present disclosure.

FIG. 11G illustrates a flexible carrier in a non-bending state.

FIG. 11H illustrates a perspective view of an LED bulb in accordancewith one embodiment of the present disclosure.

FIG. 11I illustrates a flexible carrier in a non-bending state.

FIG. 11J illustrates a perspective view of an LED bulb in accordancewith one embodiment of the present disclosure.

FIG. 12 illustrates a cross-sectional view of an LED tube in accordancewith one embodiment of the present disclosure.

FIGS. 12A˜12C illustrating a method of making the LED tube of FIG. 12.

FIGS. 13A˜13D are views illustrating a method of making a light-emittingdevice in accordance with another embodiment of the present disclosure.

FIG. 13E illustrate a cross-sectional view of a light-emitting device ofFIG. 13D.

DETAILED DESCRIPTION OF THE EMBODIMENTS

To better and concisely explain the disclosure, the same name or thesame reference number given or appeared in different paragraphs orfigures along the specification should has the same or equivalentmeanings while it is once defined anywhere of the disclosure. Inaddition, these drawings are not necessarily drawn to scale. Likewise,the relative sizes of elements illustrated by the drawings may differfrom the relative sizes depicted.

The following shows the description of embodiments of the presentdisclosure in accordance with the drawings.

FIGS. 1A and 1B illustrate a perspective view of a light emitting device100 in accordance with one embodiment of the present disclosure. Thelight-emitting device 100 includes an oblong carrier with a top surface101 and a bottom surface 102 opposite to the top surface 101, aplurality of light-emitting units 11 disposed on the top surface 101, atop electrode 20 formed on the top surface 101, a bottom electrode 30formed on the bottom surface 102, and a transparent body 103 coveringthe top electrode 20 and the light-emitting units 11. In thisembodiment, the carrier 10 has a length of 18 mm˜30 mm and a widthsmaller than 3 mm, and the light-emitting unit 11 has a width of 0.5mm˜1.5 mm and a length of 1 mm˜3 mm. Referring to FIG. 1A, the topelectrode 20 includes two top electrode pads 201, 202 and a topelectrode connector 203. Referring to FIG. 1B, the bottom electrode 30is formed on the bottom surface 102 and includes two bottom electrodepads 301, 302 and a bottom electrode connector 303. The bottom electrodeconnector 303 can be a straight line, and is physically and electricallyconnected to the two electrode pads 301, 302. As shown in FIG. 1C, aconductive connecting connector 208 is optionally formed on a side ofthe carrier 10 for electrically connecting the top electrode pad 202with the bottom electrode pad 302. Alternatively, a via hole (not shown)is formed within and penetrating the carrier 10, and a conductivematerial is fully or partly filled with the via hole for electricallyconnecting the top electrode pad 202 with the bottom electrode pad 302.In operation, when the light-emitting device 100 is connected to anexternal source (power supply) and when the conductive connectingconnector 208 is not provided, the two top electrode pads 201, 202 canbe respectively connected to a positive node and a negative node of theexternal source such that the light-emitting units 11 can emit light,that is, the external source is connected to the carrier 10 at the samesurface (top surface) but at two opposite sides. In one embodiment, whenthe conductive connecting connector 208 is further provided forelectrically connecting the top electrode pad 202 with the bottomelectrode pad 302, a positive node and a negative node of the externalsource can be respectively connected to the top electrode pad 201 andthe bottom electrode pad 301 such that the light-emitting units 11 canemit light, that is, the external source is connected to the carrier 10at the different surfaces (top surface and bottom surface) but at thesame side. By virtue of the top electrode 20, the bottom electrode 30and/or the conductive connecting connector 208, the light-emittingdevice 100 can be connected to the external source at the differentsurfaces but the same side or at the same surface but two opposite sidesfor different application of the light-emitting device.

The transparent body 103 can includes a single layer or a multilayerstructure. When the transparent body 103 is a multilayer structure (notshown), it sequentially includes a first transparent layer, a wavelengthconversion layer, and a second transparent layer. The first transparentlayer and the second transparent layer can include, e.g. epoxy,polyimide, BCB, PFCB, SU8, acrylic resin, PMMA, PET, PC, polyetherimide,fluorocarbon polymer, glass, Al₂O₃, SINR, SOG, poly(tetrafluoroethene)or combinations thereof. The wavelength conversion layer includesaluminum oxide (such as YAG or TAG), silicate, vanadate, alkaline-earthmetal silicate, alkaline-earth metal sulfide, alkaline-earth metalselenide, alkaline-earth metal gallium silicate, metal nitride, metalnitride oxide, a mixture of tungstate and molybdate, a mixture of oxide,or combinations thereof. In this embodiment, the light-emitting unit 11can emit a blue light with a peak wavelength of 430 nm˜480 nm, and someof the blue light is converted by the wavelength conversion layer toemit a yellow light with a peak wavelength of 570 nm˜590 nm or ayellowish green light with a peak wavelength of 540 nm˜570 nm.Furthermore, the yellow light or the yellowish green light is mixed withthe unconverted blue light to produce a white light.

FIG. 2A is a top view of the light-emitting device as shown in FIG. 1Awithout showing the transparent body 103. Refereeing to FIGS. 1A and 2A,the top electrode connector 203 is patterned and includes a plurality ofelectrode blocks 2031. In this embodiment, the electrode blocks 2031 arearranged in a straight line along a length direction of the carrier 10(X) and physically spaced apart from each other. Each of the electrodeblocks 2031 includes a first end 2032 and a second end 2033. In oneembodiment, a distance (d₁) between the two adjacent light-emittingunits 11 is 0.5 mm˜1.2 mm, and each of the distances between the twoadjacent light-emitting units 11 can be the same or different dependingon actual requirements. FIG. 2B is a cross-sectional view taken alongline I-I′ of FIG. 2A with the transparent body 103 included. Referringto FIG. 2B, each of the light-emitting units 11 has a first connectingpad 111 (for example, p pad) and a second connecting pad 113 (forexample, n pad). The first connecting pad 111 and the second connectingpad 113 are at positions corresponding to the first end 2032 of oneelectrode block 2031 and the second end 2033 of adjacent one electrodeblock 2031 for physically and electrically connecting therebetween.Accordingly, the light-emitting units 11 are electrically connected inseries with each other on the carrier 10. The transparent body 103 isprovided to cover portions of the top electrode 20 and thelight-emitting units 11.

FIG. 3A is a top view of a light-emitting device in accordance withanother embodiment of the present disclosure, but without showing thetransparent body. FIG. 3B is a cross-sectional view taken along lineII-II′ of FIG. 3A with the transparent body included. Referring to FIGS.3A and 3B, a top electrode connector 204 includes a first electroderegion 2041 and a second electrode region 2042. The first electroderegion 2041 and the second electrode region 2042 are parallelly andalternately arranged along the length direction of the carrier 10 (X)and physically spaced apart from each other. The light-emitting units 11are arranged along the length direction of the carrier 10 (X), and thefirst connecting pad 111 and the second connecting pad 113 are atpositions corresponding to the first electrode region 2041 and thesecond electrode region 2042 for physically and electrically connectingtherebetween. For example, the first connecting pad 111 of thelight-emitting unit 11A is corresponding to the first electrode region2041A and the second connecting pad 113 of the light-emitting unit 11Ais corresponding to the second electrode region 2042A; the firstconnecting pad 111 of the light-emitting unit 11B is corresponding tothe second electrode region 2042A and the second connecting pad 113 ofthe light-emitting unit 11B is corresponding to the first electroderegion 2041B. The second connecting pad 113 of the light-emitting unit11A and the first connecting pad 111 of the light-emitting unit 11B areboth disposed on the second electrode region 2042A for electricallyconnecting therebetween. Accordingly, the light-emitting units 11 areelectrically connected in series with each other on the carrier 10. Inthis embodiment, the second connecting pad 113 of the light-emittingunits 11A and the first connecting pad 111 of the light-emitting units11B are at the same side of the carrier 10; the first connecting pad 111of the light-emitting units 11A and the second connecting pad 113 of thelight-emitting units 11B are at another side of the carrier 10. Thelight-emitting device further includes a transparent body 103 coveringthe top electrode 20 and the light-emitting units 11.

FIG. 4A is a top view of a light-emitting device in accordance withanother embodiment of the present disclosure. Referring to FIG. 4A, atop electrode connector 205 includes a plurality of electrode zones 2051arranged along the length direction of the carrier 10 at a first obliqueangle to the length direction. Each of the electrode zones 2051 has afirst end 2052 and a second end 2053. The light-emitting units 11 arearranged along the length direction of the carrier 10 and at a secondoblique angle with respect to the electrode zones 2051. The firstoblique angle can be the same or different from the second obliqueangle. Each of the light-emitting units 11 has a first connecting pad(not shown) and a second connecting pad (not shown). The firstconnecting pad and the second connecting pad are respectively atpositions corresponding to the first end 2052 of one electrode zone 2051and the second end 2053 of adjacent one electrode zone 2051 forphysically and electrically connecting therebetween. Accordingly, thelight-emitting units 11 are electrically connected in series with eachother on the carrier 10. In this embodiment, all the second connectingpads of the light-emitting units 11 are at the same side of the carrier10 and all the first connecting pads of the light-emitting units 11 areat another side of the carrier 10.

FIG. 4B is a top view of a light-emitting device in accordance withanother embodiment of the present disclosure. Referring to FIG. 4B, atop electrode connector 206 includes a first electrode bar 2061 and asecond electrode bar 2062. The top electrode pad 201 is merely connectedto the first electrode bar 2061 and the top electrode pad 202 is merelyconnected to the second electrode bar 2062. Each of the light-emittingunits 11 has a first connecting pad (not shown) and a second connectingpad (not shown). The first connecting pad and the second connecting padare respectively at positions corresponding to the first electrode bar2061 and second electrode bar 2062 for physically and electricallyconnecting therebetween. Accordingly, the light-emitting units 11 areelectrically connected in parallel with each other on the carrier 10.

FIG. 4C is a top view of a light-emitting device in accordance withanother embodiment of the present disclosure. Referring to FIG. 4C, thetop electrode 20 includes a top electrode pad 201 and a top electrodeconnector 209 formed on the top surface 101 of the carrier 10. The topelectrode connector 209 includes a first electrode strip 2091 and thesecond electrode stripe 2092. The first electrode stripe 2091 and thesecond electrode stripe 2092 are physically spaced apart from eachother. The first electrode stripe 2091 includes a first region 20911, afirst stripe 20912 electrically connecting to and extending from thefirst region 20911 along the length direction of the carrier 10 (−X),and a plurality of first branches 20913 electrically connecting to andextending from the first stripe 20912 along the width direction of thecarrier 10 (−Y). The second electrode stripe 2092 includes a secondstripe 20921 electrically connecting to and extending from the topelectrode pad 201 along the length direction of the carrier 10 (−X); anda plurality of second branches 20922 electrically connecting to andextending from the second stripe 20921 along the width direction of thecarrier 10 (Y). The first stripe 20912 and the second stripe 20921 areparallel with each other; and the first branches 20913 and the secondbranches 20922 are alternately and parallelly arranged with each other.Each of the light-emitting units 11 has a first connecting pad (notshown) and a second connecting pad (not shown) which are at positionsrespectively corresponding to the first branches 20913 and the secondbranches 20922 for electrically connecting therebetween.

FIG. 4D illustrates a bottom view of the light-emitting device in FIG.4C. The bottom electrode 30 includes a bottom electrode pad 301 and abottom electrode connector 310 formed on the bottom surface 102 of thecarrier 10. The bottom electrode line 310 includes a third electrodestripe 3101 and the fourth electrode stripe 3102. The third electrodestripe 3101 and the fourth electrode stripe 3102 are physically spacedapart from each other. The third electrode stripe 3101 includes a secondregion 31011, a third stripe 31012 electrically connecting to andextending from the second region 31011 along the length direction of thecarrier 10 (−X), and a plurality of third branches 31013 electricallyconnecting to and extending from the third stripe 31012 along the widthdirection of the carrier 10 (−Y). The fourth electrode stripe 3102includes a third region 31021, a fourth stripe 31022 electricallyconnecting to and extending from the bottom electrode pad 301 along thelength direction of the carrier 10 (−X); and a plurality of fourthbranches 31023 extending from and electrically connecting to the fourthstripe 31022 along the width direction of the carrier 10 (Y). The thirdstripe 31012 and the fourth stripe 31022 are parallel with each other;and the third branches 31013 and the fourth branches 31023 arealternately and parallelly arranged with each other. Each of thelight-emitting units 11 has a first connecting pad (not shown) and asecond connecting pad (not shown) which are at positions respectivelycorresponding to the fourth branches 31023 and the third branches 31013for electrically connecting therebetween. Referring to FIGS. 4C and 4D,the first region 20911 is at the position corresponding to the thirdregion 31021 and a hole 211 penetrates through the carrier 10 at thefirst region 20911 and the third region 31021; the second region 31011is at the position corresponding to the top electrode pad 201 and a hole212 penetrates through the carrier 10 at the second region 31011 and thetop electrode pad 201. The holes 211, 212 can include a conductivematerial fully or partly filled therewithin for electrically connectingthe opposite surfaces of the carrier 10 with each other. To be morespecific, when a positive node and a negative node of the externalsource are electrically connected to the top electrode pad 201 and thebottom electrode pad 301, respectively, the top electrode pad 201 iselectrically connected to the second region 31011 through the hole 212for further electrically connecting to the third stripe 31012 and thethird branches 31013. In other words, the top electrode pad 201, thesecond electrode stripe 2092 and the third electrode stripe 3101 areelectrically connected to the positive node of the external source.Likewise, the first region 20911 is electrically connected to the thirdregion 31021 through the hole 211. Since the third region 31021 iselectrically connected to the bottom electrode pad 301, the bottomelectrode pad 301 can be electrically connected to the first stripe20912 and the first branches 20913. In other words, the bottom electrodepad 301, the first electrode strip 2091 and the fourth electrode stripe3102 are electrically connected to the negative node of the externalsource. Accordingly, the light-emitting units 11 on the top surface 101and the bottom surface 102 are all electrically connected in parallelwith each other for emitting light. In this embodiment, with the hole211, the first stripe 20912 and the fourth stripe 31022 are electricallyconnected to each other. In other embodiment, instead of forming thefirst stripe 20912, the first regions 20911 and the hole 211, aplurality of individual holes is formed corresponding to each the firstbranch 20913 for electrically connecting the first branch 20913 with thefourth stripe 31022.

FIG. 4E illustrates a top view of the light-emitting device inaccordance with another embodiment of the present disclosure. The topelectrode connector 207 includes a first electrode region 2071, a secondelectrode region 2072, and a third electrode region 2073. The firstelectrode region 2071, the second electrode region 2072, and the thirdelectrode region 2073 are all rectangle. The long sides of the firstelectrode region 2071 and the third electrode region 2073 are parallelwith the short side (width) of the carrier; the short side of the secondelectrode region 2072 is parallel with the long side (length) of thecarrier. A plurality of the light-emitting units is disposed on thecarrier 10 and electrically connected to each other in a bridgeconfiguration by the arrangement of the top electrode connector 207. Thelight-emitting units have the first connecting pad and the secondconnecting pad. It is noted that from the top view of FIG. 4E, the firstconnecting pad and the second connecting pad cannot be clearly viewed.However, for clarifying this embodiment the first connecting pad and thesecond connecting pad are labeled in FIG. 4E. To be more specific, thefirst connecting pad 111C of the light-emitting unit 11C is at the firstelectrode region 2071 for electrically connecting therebetween; thesecond connecting pad 113C of the light-emitting unit 11C is at thesecond electrode region 2072A for electrically connecting therebetween;the first connecting pad 111D of the light-emitting unit 11D is at thethird electrode region 2073 for electrically connecting therebetween;the second connecting pad 113D of the light-emitting unit 11D is at thesecond electrode region 2072A for electrically connecting therebetween;the first connecting pad 111E of the light-emitting unit 11E is at thesecond electrode region 2072A for electrically connecting therebetween;the second connecting pad 113E of the light-emitting unit 11E is at thesecond electrode region 2072B for electrically connecting therebetween;the first connecting pad 111F of the light-emitting unit 11F is at thesecond electrode region 2072B for electrically connecting therebetween;the second connecting pad 113F of the light-emitting unit 11F is at thefirst electrode region 2071 for electrically connecting therebetween;and the first connecting pad 111G of the light-emitting unit 11G is atthe second electrode region 2072B for electrically connectingtherebetween; the second connecting pad 113G of the light-emitting unit11G is at the third electrode region 2073 for electrically connectingtherebetween such that the light-emitting units 11C, 11D, 11E, 11F, 11Gare electrically connected to each other in the bridge configuration.Therefore, the light-emitting device can be directly connected to analternately current (AC) power supply. FIG. 4G is an equivalent circuitof FIG. 4E. In the positive cycle of the alternately current powersupply, a positive-cycle current passes through the light-emitting units11C, 11E, 11G; and in the negative cycle of the alternately currentpower supply, a negative-cycle current passes through the light-emittingunits 11D, 11E, 11F. In this embodiment, only one bridge configurationis described, however, there can be a plurality of bridge configurationsformed on the carrier 10 for electrically connecting to each other. Inaddition, the quantity of the bridge configurations is adjustabledepending on a desired voltage (for example, 110V, 120V, 220V or 240V).FIG. 4F illustrates a top view of a light-emitting device in accordancewith another embodiment of the present disclosure. The light-emittingdevice in FIG. 4F is similar with that in FIG. 4E, except that thesecond electrode region 2072 can includes a plurality of sub electroderegions 2072C between the sub electrode regions 2072A, 2072B. Aplurality of light-emitting units 11E is arranged on the sub electroderegions 2072A, 2072C, 2072B for electrically connecting in series toeach other. In other embodiment, the light-emitting units 11E can beconnected to each other in parallel or in series-parallel.

FIG. 5A illustrates a cross-sectional view of the light-emitting device200 in accordance with another embodiment of the present disclosure.FIGS. 5B and 5C are a top view and a bottom view without showing thelight-emitting units, respectively. Referring to FIGS. 5A˜5C, thelight-emitting device 200 includes a carrier 10′ having a top surface101′ and a bottom surface 102′ opposite to the top surface 101′, aplurality of light-emitting units 12A, 12B respectively disposed on thetop surface 101′ and the bottom surface 102′, a top electrode 20′ on thetop surface 101′, a bottom electrode 30′ formed on the bottom surface102′, and a transparent body 103 covering the top electrode 20′, thebottom electrode 30′, and the light-emitting units 12A, 12B. As shown inFIG. 5B, the top electrode 20′ includes a top electrode pad 201′, aplurality of first electrode parts 2011′ and a plurality of secondelectrode parts 2012′. The first electrode part 2011′ and the secondelectrode part 2012′ are arranged in a straight line along a lengthdirection of the carrier 10′ (X), and physically and alternately spacedapart from each other. The second electrode part 2012′ includes aplurality of sub electrode part 20121′ spaced apart from each other. Inthis embodiment, the first electrode part 2011′ between two adjacentsecond electrode parts 2012′ has a length smaller than that of thesecond electrode part 2012′. A distance between two adjacentlight-emitting units is smaller than a length of one of thelight-emitting units. In this embodiment, the second electrode part2012′ includes three sub electrode parts 20121′ which are spaced apartfrom each other by a distance. Referring to FIGS. 5A and 5B, thelight-emitting unit 12A has a first connecting pad (not shown) at aposition corresponding to the first electrode part 2011′ forelectrically connecting therebetween, and the light-emitting unit 12Ahas a second connecting pad (not shown) at a position corresponding toadjacent one first electrode part 2011′ for electrically connectingtherebetween, such that the light-emitting unit 12A partially covers thefirst electrode part 2011′ and the adjacent first electrode part 2011′,and fully covers the second electrode part 2012′. The second electrodepart 2012′ contacts the light-emitting unit 12A but is not electricallyconnected to the light-emitting unit 12A for dissipating heat from thelight-emitting unit 12A to the ambient (air). It is noted that the“contact” means directly contact or indirectly contact. The indirectlycontact indicates a conductive material (for example: solder) or anon-conductive material (for example: adhesive) formed between thelight-emitting unit 12A and the second electrode part 2012′. In anotherembodiment, the second electrode part 2012′ can also be electricallyconnected to the light-emitting unit 12A. Referring to FIG. 5C, thebottom electrode 30′ includes a bottom electrode pad 301′, a pluralityof third electrode parts 3011′ and a plurality of fourth electrode parts3012′. The bottom electrode 30′ has a pattern similar with that of thetop electrode 20′. The third electrode parts 3011′ and the fourthelectrode parts 3012′ are arranged in a straight line along a lengthdirection of the carrier 10′ (X), and physically and alternately spacedapart from each other. The fourth electrode part 3012′ includes threesub electrode parts 30121′ spaced apart from each other. Referring toFIGS. 5A and 5C, the light-emitting unit 12B has a first connecting pad(not shown) at a position corresponding to the third electrode part3011′ for electrically connecting therebetween, and the light-emittingunit 12B has a second connecting pad (not shown) at a positioncorresponding to adjacent third electrode part 3011′ for electricallyconnecting therebetween. The fourth electrode part 3012′ contacts thelight-emitting unit 12B but is not electrically connected to thelight-emitting unit 12B for dissipating heat from the light-emittingunit 12B to the ambient (air). In another embodiment, the fourthelectrode part 3012′ can also be electrically connected to thelight-emitting unit 12B. It is noted that the first electrode part 2011′and the fourth electrode part 3012′ are respectively formed on the topsurface 101′ and the bottom surface 102′ at the position correspondingto each other, and the second electrode part 2012′ and the thirdelectrode part 3011′ are respectively formed on the top surface 101′ andthe bottom surface 102′ at the position corresponding to each other.Accordingly, the light-emitting units 12A on the top surface 101′ andthe light-emitting units 12B on the bottom surface 102′ are alternatelyarranged, and the light-emitting units 12A does not fully overlap thelight-emitting units 12B. The quantity, the shape, and the length of thesub electrode parts can be varied. The distance between the subelectrode parts can also be varied. Moreover, the quantity, the shape,and the length of the first electrode part 2011′, the second electrodepart 2012′, the third electrode part 3011′, the fourth electrode part3012′ can also be varied. In this embodiment, like FIG. 1C, a conductiveconnecting connector 208 is optionally formed on a side of the carrier10′ for electrically connecting the first electrode part 2011′ at theend position with the third electrode part 3011′ at the end position.Alternatively, a hole (not shown) is optionally formed to penetratethrough the carrier 10′ and a conductive material is fully or partlyfilled with the hole for electrically connecting the first electrodepart 2011′ with the third electrode part 3011′. Therefore, in operation,when the light-emitting device is connected to the external source, apositive node and a negative node of the external source can beelectrically connected to the top electrode pad 201′ and the bottomelectrode pad 301′ such that the light-emitting units 12A, 12B areelectrically connected in series to each other for emitting light, thatis, the external source is connected to the carrier 10 at the differentsurfaces (top surface and bottom surface) but at the same side.

FIG. 5D illustrates a cross-sectional view of the light-emitting device200′ in accordance with another embodiment of the present disclosure.FIG. 5E illustrates a cross-sectional view of the light-emitting device200′ in accordance with another embodiment of the present disclosure.The light-emitting device 200′ has a structure similar with thelight-emitting device 200. The devices, elements or steps with similaror the same symbols represent those with the same or similar functions.The light-emitting device 200′ further includes a dam 35 formed on thetop surface 101′ and/or the bottom surface 102′ to surround thelight-emitting units 12A, 12B (as shown in FIG. 5E). Subsequently, atransparent body 103 is formed on the light-emitting units 12A, 12B andthe dam 35. In this embodiment, the dam 35 has a height (0.3 mm˜0.75 mm)lower than that of the light-emitting units 12A, 12B (0.8 mm˜1 mm),thereby a coverage range of the transparent body 103 can besubstantially limited by the dam 35. Using the same amount oftransparent body 103, compared to the light-emitting device without thedam 35, the transparent body 103 of the light-emitting device with thedam 35 has a smooth top surface for improving a uniformity of theemitting angle of the light-emitting device. The dam 35 is made of amaterial the same or different from the transparent body 103 andincluding silicone, epoxy, polyimide, BCB, PFCB, SU8, acrylic resin,PMMA, PET, PC, polyetherimide, fluorocarbon polymer, glass, Al₂O₃, SINR,SOG, Poly(tetrafluoroethene) or combinations thereof.

FIGS. 6A and 6B illustrate cross-sectional views of the light-emittingdevice 300 in accordance with another embodiment of the presentdisclosure. FIG. 6C illustrates a top view of the light-emitting device300 without showing an electrical plate 25. The light-emitting device300 includes a carrier 10″ having a top surface 101″ and a bottomsurface 102″ opposite to the top surface 101″, a plurality oflight-emitting units 13 disposed on the top surface 101″, a topelectrode 20″ on the top surface 101″, an electrical plate 25, and atransparent body 103 covering the top electrode 20″, the light-emittingunits 13 and part of the electrical plate 25. As shown in FIG. 6C, thetop electrode 20″ includes a first electrode pad 201″, a secondelectrode pad 202″, a plurality of first electrode parts 2011″, aplurality of second electrode parts 2012″, and a third electrode part2013″. The first electrode pad 201″ and the second electrode pad 202″are arranged at the same side and the same surface (the top surface).The first electrode part 2011″ and the second electrode part 2012″ arearranged in a straight line along a length direction of the carrier 10″(X), and physically and alternately spaced apart from each other. Thethird electrode part 2013″ is a straight line and parallel with thefirst electrode part 2011″ and the second electrode part 2012″. The topelectrode 20″ further includes a bended part 2014″ which has an endarranged in a straight line with and spaced apart from the secondelectrode part 2012″ while the other end is physically and electricallyconnected to the third electrode part 2013″. The second electrode part2012″ includes a plurality of sub electrode part 20121″ spaced apartfrom each other. In this embodiment, the second electrode part 2012″includes three sub electrode parts 20121″ spaced apart from each otherby a distance. Referring to FIG. 6A, the light-emitting unit 13 has afirst connecting pad (not shown) at a position corresponding to thefirst electrode part 2011″ for electrically connecting therebetween, andthe light-emitting unit 13 has a second connecting pad (not shown) at aposition corresponding to adjacent first electrode part 2011′ forelectrically connecting therebetween. The second electrode part 2012″contacts the light-emitting unit 13 but is not electrically connected tothe light-emitting unit 13 for dissipating heat from the light-emittingunit 13 to the ambient (air). In another embodiment, the secondelectrode part 2012″ can also be electrically connected to thelight-emitting unit 13. As shown in FIGS. 6A, 6B, 6D, and 6E, theelectrical plate 25 includes a board 250 having a top surface 251 and abottom surface 252 opposite to the top surface 251, a first electrodeblock 253 formed on the top surface 251 and a second electrode block 254formed on the bottom surface 252. Referring to FIG. 6D, the firstelectrode block 253 has a first section 2531 and a second section 2532connecting to the first section 2531. Referring FIG. 6E, the secondelectrode block 254 has a third section 2541, and a fourth section 2542without physically connecting to the third section 2541. The secondsection 2532 and the fourth section 2542 are respectively formed on thetop surface 251 and the bottom surface 252 at the position correspondingto each other. A hole 255 penetrates through the board 250 at the secondsection 2532 and the fourth section 2542 (as shown in FIG. 6A), and aconductive material can be fully or partly filled within the hole 255for electrically connecting the second section 2532 with the fourthsection 2542. The electrical plate 25 is disposed at a positioncorresponding to the top electrode 20″ of the carrier 10″, the fourthsection 2542 is physically and electrically connected to the firstelectrode pad 201″, the third section 2541 is physically andelectrically connected to the second electrode pad 202″, and the fourthsection 2542 is electrically connected to the first electrode block 253through the conductive material filled within the hole 255. Inoperation, a positive node and a negative node of the external sourcecan be electrically connected to the first section 2531 of the firstelectrode block 253 and the third section 2541 of the second electrodeblock 254 such that the light-emitting units 13 can emit light.Specifically, the first electrode block 253 is electrically connected tothe fourth section 2542 through the conductive material filled withinthe hole 255, and the fourth section 2542 is physically and electricallyconnected to the first electrode pad 201″, thus the positive node of theexternal source can be electrically connected to the first electrode pad201″. Likewise, the negative node of the external source can beelectrically connected to the second electrode pad 202″ through thethird section 2541. Since the positive node and the negative node of theexternal source can be electrically connected to the first electrodeblock 253 and the second electrode block 254, respectively, and thefirst electrode block 253 and the second electrode block 254 arerespectively arranged on the top surface 251 and the bottom surface 252of the electrical plate 25, the external source is connected to theelectrical plate 25 at the different surfaces (top surface 251 andbottom surface 252) but at the same side. By virtue of the hole 255, thefirst section 253 is connected to the first electrode pad 201″ such thatthe positive node and the negative node of the external source can beelectrically connected to the first electrode pad 201″ and the secondelectrode pad 202″, respectively, and the first electrode pad 201″ andthe second electrode pad 202″ are formed on the top surface 101″ of thecarrier 10″, therefore, the external source is connected to the carrier10″ at the same surface (top surface 101″) and at the same side. Inanother embodiment, the first electrode block and the second electrodeblock can be designed to form on the top surface of the electrical plateand a hole is formed at the first electrode block and the secondelectrode block. With the conductive material filled within the hole,the first electrode block and the second electrode block areelectrically connected to the first electrode pad and the secondelectrode pad, respectively, therefore, the external source is connectedto the electrical plate at the same surface (top surface 101) and at thesame side.

It is noted that the sub electrode parts described in FIG. 5A can alsobe formed in FIGS. 2A, 3A 4A˜4E. In other words, there are sub electrodeparts formed between the electrode blocks 2031 in FIG. 2A; there are subelectrode parts formed between the first electrode region 2041 and thesecond electrode region 2042 in FIG. 3A; there are sub electrode partsformed between the electrode zones 2051 in FIG. 4A; there are subelectrode parts formed between the first electrode bar 2061 and thesecond electrode bar 2062 in FIG. 4B; there are sub electrode partsformed between the first branch 20913 and the second branch 20922 inFIG. 4C; there are sub electrode parts formed between the third branch31013 and the fourth branch 31023 in FIG. 4D; and there are subelectrode parts formed between the first electrode region 2071, thesecond electrode region 2072, and the third electrode region 2073. Thesub electrode parts contacts the light-emitting unit but is notelectrically connected to the light-emitting unit for dissipating heatfrom the light-emitting unit to the ambient (air). In anotherembodiment, the sub electrode parts can also be electrically connectedto the light-emitting unit.

FIG. 7A illustrates a cross-sectional view of a light-emitting diodeunit 1000 in accordance with one embodiment of the present disclosure,which can be used as any one of the light-emitting units 11, 12A, 12B,13 in FIGS. 1A, 3A, 4A˜4F, 5A, 5D, and 6A. The light-emitting diode unit1000 includes a substrate 7000, a first-type semiconductor layer 7001,an active layer 7002, and a second-type semiconductor layer 7003. Thefirst-type semiconductor layer 7001 and the second-type semiconductorlayer 7003, for example a cladding layer or a confinement layer,respectively provide electrons and holes such that electrons and holescan be combined in the active layer 7002 to emit light. A firstconductive portion 7004 and a second conductive portion 7005 are formedon the second-type semiconductor layer 7003 and the first-typesemiconductor layer 7001, respectively. The light-emitting diode unit1000 is a flip-chip light-emitting diode unit. In another embodiment,the light-emitting diode unit 1000 can further includes a wavelengthconversion material (not shown) formed on the substrate 7000 to convertlight emitted by the active layer 7002. In another embodiment, thelight-emitting diode unit 1000 is a thin-film light-emitting diodestructure without the substrate 7000. Therefore, a wavelength conversionmaterial (not shown) is directly formed on the first-type semiconductorlayer 7001. It is noted that when the light-emitting diode unit 1000 isused as any one of the light-emitting units 11, 12A, 12B, 13 in FIGS.1A, 3A, 4A˜4F, 5A, 5D, and 6A, the first conductive portion 7004 acts asthe previously described first connecting pad or the second connectingpad, and the second conductive portion 7005 acts as the previouslydescribed second connecting pad or the first connecting pad.Accordingly, a connection configuration between the first conductiveportion 7004, the second conductive portion 7005, the top electrodeor/and the bottom electrode is the same as the connection configurationbetween the first (second) connecting pad, the second (first) connectingpad, the top electrode or/and the bottom electrode. The light-emittingdiode unit 1000 further includes a protective layer 7006 made of atransparent insulation material with a high thermal conductivitycoefficient (for example, diamond like carbon) and formed to cover thefirst-type semiconductor layer 7001, the second-type semiconductor layer7003, and the active layer 7002. Therefore, when the light-emittingdiode unit 1000 is used as the light-emitting units 12A, 12B, 13 inFIGS. 5A and 6A, the protective layer 7006 can contact the electrodepart 2012′, 3012′, 2012″ for dissipating heat from the light-emittingdiode unit 1000 to the ambient (air). Furthermore, the protective layer7006 can also include a reflective material therein (for example, TiO₂,SiO₂, Al₂O₃, ZrO₂, ZnS, ZnO, or MgO).

FIG. 7B illustrates a cross-sectional view of a light-emitting diodeunit 1001 in accordance with one embodiment of the present disclosure.The light-emitting diode unit 1001 has a structure similar with thelight-emitting diode unit 1000, and can also be used as any one of thelight-emitting units 11, 12A, 12B, 13 in FIGS. 1A, 3A, 4A˜4F, 5A, and6A. The devices, elements or steps with similar or the same symbolsrepresent those with the same or similar functions. The light-emittingdiode unit 1001 further includes a reflective layer 7007 to cover thefirst-type semiconductor 7001, the second-type semiconductor 7003, andthe active layer 7002. Accordingly, the light emitted from the activelayer 7002 is able to be reflected toward the substrate 7000. Thelight-emitting diode unit 1001 can also include a protective layer 7006formed on the reflective layer 7007 that is made of a transparentinsulation material with a high thermal conductivity coefficient (forexample, diamond like carbon). When the light-emitting diode unit 1001is used as the light-emitting units 12A, 12B, 13 in FIGS. 5A and 6A, theprotective layer 7006 can contact the electrode part 2012′, 3012′, 2012″for dissipating heat from the light-emitting diode unit 1001 to theambient (air). The reflective layer 7007 comprises insulating material,such as SiO_(x), Al₂O₃, TiO₂ or combinations thereof.

FIG. 7C illustrates a cross-sectional view of a light-emitting diodeunit 1002 in accordance with one embodiment of the present disclosure.The light-emitting diode unit 1002 has a structure similar with thelight-emitting diode unit 1000 and can also be used as any one of thelight-emitting unit 11, 12A, 12B, 13 in FIGS. 1A, 3A, 4A˜4F, 5A, and 6A.The devices, elements or steps with similar or the same symbolsrepresent those with the same or similar functions. The light-emittingdiode unit 1000 merely includes a light-emitting diode; however, thelight-emitting diode unit 1002 includes a plurality of light-emittingdiodes commonly formed on a common substrate 7010. The light-emittingdiodes are physically spaced apart from each other on the commonsubstrate 7010 and a conductive structure 7015 is provided toelectrically connect the light-emitting diodes with each other inseries, in parallel or in series-parallel such that the light-emittingdiode unit 1002 is capable of operating in a high voltage (an operatingvoltage (such as 6V, 12V, 24V, 36V, or 45V) is larger than the forwardvoltage of a light-emitting diode (about 3V)). In this embodiment, thelight-emitting diode unit 1002 includes three light-emitting diodes andhas an operating voltage of about 9V (3V*3=9V). An insulation layer 7016formed between the light-emitting diodes and the conductive structure7015 for avoiding an undesired electrical path. In another embodiment,as shown in FIGS. 7A and 7B, the light-emitting diode unit 1002 conincludes a protective layer (not shown) for covering the first-typesemiconductor 7001, the second-type semiconductor 7003, the active layer7002 and the conductive structure 7015. Alternatively, a reflectivelayer (not shown) is provided to cover the first-type semiconductor7001, the second-type semiconductor 7003, and the active layer 7002.Accordingly, the light emitted from the active layer 7002 is able to bereflected toward the substrate 7000. Likewise, when the light-emittingdiode unit 1002 is used as the light-emitting unit 12A, 12B, 13 in FIGS.5A and 6A, the protective layer 7006 can contact the electrode part2012′, 3012′, 2012″ for dissipating heat from the light-emitting diodeunit 1002 to the ambient (air). It is noted that the light-emittingdiode unit 1002 merely has one first conductive portion 7004′ formed onthe second-type semiconductor layer 7003 of one light-emitting diode andone second conductive portion 7005′ are formed on the first-typesemiconductor layer 7001 of another light-emitting diode. When thelight-emitting diode unit 1002 is used as the light-emitting unit 11,12A, 12B, 13 in FIGS. 1A, 3A, 4A˜4F, 5A, 5D, and 6A, the firstconductive portion 7004′ acts as the previously described firstconnecting pad or the second connecting pad, and the second conductiveportion 7005′ acts as the previously described second connecting pad orthe first connecting pad. Accordingly, a connection configurationbetween the first conductive portion 7004′, the second conductiveportion 7005′, the top electrode or/and the bottom electrode is the sameas the connection configuration between the first (second) connectingpad, the second (first) connecting pad, the top electrode or/and thebottom electrode. By connecting the first conductive portion 7004′ andthe second conductive portion 7005′ to the external source, all thelight-emitting diodes can emit light. The reflective layer 7007 includesan insulating material, such as SiO_(x), Al₂O₃, TiO₂ or combinationsthereof.

FIG. 7D illustrates a cross-sectional view of a light-emitting diodeunit 1003 in accordance with one embodiment of the present disclosure.The light-emitting diode unit 1003 has a structure similar with thelight-emitting diode unit 1000 and can also be used as any one of thelight-emitting units 11, 12A, 12B, 13 in FIGS. 1A, 3A, 4A˜4F, 5A, and6A. The devices, elements or steps with similar or the same symbolsrepresent those with the same or similar functions. The light-emittingdiode unit 1003 further includes a first expansion electrode portion7024 that is physically and electrically connected to the firstconductive portion 7004, and that has an area greater than that of thefirst conductive portion 7004; and a second expansion electrode portion7025 that is physically and electrically connected to the secondconductive portion 7005 and that has an area greater than that of thesecond conductive portion 7005. Likewise, when the light-emitting diodeunit 1003 is used as the any one of light-emitting units 11, 12A, 12B,13 in FIGS. 1A, 3A, 4A˜4F, 5A, 5D, and 6A, the first expansion electrodeportion 7024 acts as the previously described first (second) connectingpad), and the second expansion electrode portion 7025 acts as thepreviously described second (first) connecting pad. Accordingly, aconnection configuration between the first expansion electrode portion7024, the second expansion electrode portion 7025, the top electrodeor/and the bottom electrode is the same as the connection configurationbetween the first (second) connecting pad, the second (first) connectingpad, the top electrode or/and the bottom electrode. In this embodiment,the first expansion electrode portion 7024 and the second expansionelectrode portion 7025 are provided for facilitating a subsequentalignment process.

FIG. 8A illustrates a cross-sectional view of a light-emitting diodeunit 2000 in accordance with one embodiment of the present disclosure,which can be used as any one of the light-emitting units 11, 12A, 12B,13 in FIGS. 1A, 3A, 4A˜4F, 5A, 5D, and 6A. The light-emitting diode unit2000 has a structure similar with the light-emitting diode unit 1003.The devices, elements or steps with similar or the same symbolsrepresent those with the same or similar functions. The light-emittingdiode unit 2000 includes a substrate 7000, a first-type semiconductorlayer 7001, an active layer 7002 and a second-type semiconductor layer7003. The first-type semiconductor layer 7001 and the second-typesemiconductor layer 7003, for example a cladding layer or a confinementlayer, respectively provide electrons and holes such that electrons andholes can be combined in the active layer 7002 to emit light. A firstconductive portion 7004 and a second conductive portion 7005 are formedon the second-type semiconductor layer 7003 and the first-typesemiconductor layer 7001, respectively. The light-emitting diode unit2000 is a flip-chip light-emitting diode unit. A space 7008 is formedbetween the first conductive portion 7004 and the second conductiveportion 7005. The first conductive portion 7004 has a contact surface70041 and the second conductive portion 7005 has a contact surface 70051substantially coplanar with the contact surface 70041. A transparentsubstance covers the substrate 7000, the first-type semiconductor layer7001, the active layer 7002 and the second-type semiconductor layer 7003and further fully fills into the space 7008 to form a first transparentstructure 7026. In another embodiment, the transparent substance doesnot fully fill the space 7008, and there may have air between the firstconductive portion 7004 and the second conductive portion 7005. Thefirst transparent structure 7026 has a surface 70261 substantiallycoplanar with the contact surface 70041, 70051. Subsequently, theprotective layer 7006 formed on a surface of the first transparentstructure 7026 to expose the first conductive portion 7004 and thesecond conductive portion 7005. A first expansion electrode portion 7024and a second expansion electrode portion 7025 formed on and electricallyconnected to the first conductive portion 7004 and the second conductiveportion 7005, respectively, and further formed on the protective layer7006. In this embodiment, the first expansion electrode portion 7024 hasa sidewall 70241 not coplanar with a sidewall 70061 of the protectivelayer 7006; the second expansion electrode portion 7025 has a sidewall70251 not coplanar with another sidewall 70062 of the protective layer7006. In other embodiment, the sidewall 70241 of the first expansionelectrode portion 7024 can be coplanar with a sidewall 70061 of theprotective layer 7006; the sidewall 70251 of the second expansionelectrode portion 7025 can be coplanar with the another sidewall 70062of the protective layer 7006. The light-emitting diode unit 2000 furtherincludes a second transparent structure 7027 formed on the firsttransparent structure 7026. The first transparent structure 7026includes silicone, epoxy, polyimide (PI), BCB, perfluorocyclobutane(PFCB), SUB, acrylic resin, polymethyl methacrylate (PMMA), polyethyleneterephthalate (PET), polycarbonate (PC), polyetherimide, fluorocarbonpolymer, Al₂O₃, SINR, or spin-on-glass (SOG). The second transparentstructure 7027 can include sapphire, diamond, glass, epoxy, quartz,acryl resin, SiO_(x), Al₂O₃, ZnO, silicone, and/or any combinationthereof.

FIG. 8B illustrates a cross-sectional view of a light-emitting diodeunit 2001 in accordance with one embodiment of the present disclosure,which can be used as any one of the light-emitting units 11, 12A, 12B,13 in FIGS. 1A, 3A, 4A˜4F, 5A, 5D, and 6A. The light-emitting diode unit2001 has a structure similar with the light-emitting diode unit 2000.The devices, elements or steps with similar or the same symbolsrepresent those with the same or similar functions. The light-emittingdiode unit 2000 merely includes a light-emitting diode; however, thelight-emitting diode unit 2001 includes a plurality of light-emittingdiodes. In this embodiment, each of the light-emitting diodes has arespective substrate, but in another embodiment, as shown in FIG. 7C,the light-emitting diodes can be commonly formed on a substrate. Thelight-emitting diodes are electrically connected to each other (inseries, in parallel or in series-parallel) through a conductivestructure 7015′. In this embodiment, the conductive structure 7015′physically and electrically connects the second conductive portion 7005of one light-emitting diode with the first conductive portion 7004 ofadjacent light-emitting diode in series. The transparent structure 7026covers the light-emitting units. It is noted that when thelight-emitting diode unit 2001 is used as any one of the light-emittingunits 11, 12A, 12B, 13 in FIGS. 1A, 3A, 4A˜4F, 5A, 5D, and 6A, the firstexpansion electrode portion 7024 acts as the previously described first(second) connecting pad, and the second expansion electrode portion 7025acts as the previously described second (first) connecting pad.Accordingly, a connection configuration between the first expansionelectrode portion 7024, the second expansion electrode portion 7025, thetop electrode or/and the bottom electrode is the same as the connectionconfiguration between the first (second) connecting pad, the second(first) connecting pad, the top electrode or/and the bottom electrode.By connecting the first expansion electrode portion 7024 and the secondexpansion electrode portion 7025 to the external source, thelight-emitting diodes can emit light. FIG. 8C is a partiallycross-sectional view where the light-emitting diode unit 2001 is appliedin the light-emitting device of FIG. 5. In this embodiment, only onelight-emitting diode unit 2001 is shown to be disposed on the carrier10. The light-emitting diode unit 2001 includes four light-emittingdiodes 12A1, 12A2, 12A3, 12A4. The first expansion electrode portion7024 merely covers partial of the first electrode part 2011′A and thesecond expansion electrode portion 7025 and merely cover partial of thefirst electrode part 2011′B. The conductive structure 7015′ includes aplurality of sub conductive structures 70151′ which all are notphysically connected to the first electrode parts 2011′A, 2011′B. Thefirst electrode part 2011′A is merely physically connected to thelight-emitting diodes 12A1, the second electrode part 2012′ isphysically connected to the light-emitting diodes 12A1, 12A2, 12A3,12A4, and the first electrode part 2011′B is merely physically connectedto the light-emitting diodes 12A4. The first transparent structure 7026merely cover partial of the first electrode part 2011′A, 2011′B butcover full of the second electrode part 2012′. A protective layer 7006is formed between the conductive structure 7015′ and the firsttransparent structure 7026. The conductive structure 7015′ can bephysically connected to the electrode part 2012′ (3012′) for dissipatingheat from the light-emitting diode unit 2001 to the ambient (air).Similarly, the light-emitting diode unit 2001 can also be used as thelight-emitting unit 13 in FIG. 6A. Alternatively, when thelight-emitting device of the aforesaid embodiments further has subelectrode parts, the light-emitting diode unit 2001 can still be used asany one of the light-emitting unit of these light-emitting devices. Inthis embodiment, the conductive structure 7015′ includes Au, Al, Cu, orPt, and is electrically connected to the electrode part 2012′ (3012′,2012″). The conductive structure 7015′ has a shape or area as the sameas that of the electrode part 2012′ (3012′, 2012″). Referring to FIGS.5A, 8C (6A), the electrode part 2012′ (3012′, 2012″) has three subelectrode parts 20121′ (30121′, 20121″) and the conductive structure7015′ has three sub conductive structures 70151′, that is, the amount ofthe sub electrode parts is equal to (corresponding to) the subconductive structures. In other embodiment, the sub conductive structure70151′ has an area smaller than that of the corresponding sub electrodepart.

FIG. 8D illustrates a cross-sectional view of a light-emitting diodeunit 2002 in accordance with one embodiment of the present disclosure,which can be used as any one of the light-emitting units 11, 12A, 12B,13 in FIGS. 1A, 3A, 4A˜4F, 5A, 5D, and 6A. The devices, elements orsteps with similar or the same symbols represent those with the same orsimilar functions. The light-emitting diode unit 2001 includes aplurality of light-emitting diodes commonly formed on a common substrate7000. The light-emitting diodes are physically spaced apart from eachother on the common substrate 7000 and a conductive structure 7015 isprovided to electrically connect the light-emitting diodes with eachother in series, in parallel or in series-parallel such that thelight-emitting diode unit 2002 is capable of operating in a high voltage(an operating voltage (such as 6V, 12V, 24V, 36V, or 45V) larger thanthe forward voltage of a light-emitting diode (about 3V)). In thisembodiment, the light-emitting diode unit 2002 includes fourlight-emitting diodes and has an operating voltage of about 12V(3V*4=12V). An insulation layer 7016 is formed between thelight-emitting diodes and the conductive structure 7015 for avoiding anundesired electrical path. It is noted that the light-emitting diodeunit 2002 merely has one first conductive portion 7004 formed on thesecond-type semiconductor layer 7003 of one light-emitting diode and onesecond conductive portion 7005 formed on the first-type semiconductorlayer 7001 of another light-emitting diode. When the light-emittingdiode unit 2002 is used as any one of the light-emitting units 11, 12A,12B, 13 in FIGS. 1A, 3A, 4A˜4F, 5A, 5D, and 6A, the first conductiveportion 7004 acts as the previously described first connecting pad orthe second connecting pad, and the second conductive portion 7005 actsas the previously described second connecting pad or the firstconnecting pad. Accordingly, a connection configuration between thefirst conductive portion 7004, the second conductive portion 7005, thetop electrode or/and the bottom electrode is the same as the connectionconfiguration between the first (second) connecting pad, the second(first) connecting pad, the top electrode or/and the bottom electrode.By connecting the first conductive portion 7004 and the secondconductive portion 7005 to the external source, all the light-emittingdiodes can emit light. The first transparent structure 7026 covers allthe light-emitting units.

The aforesaid light-emitting diode units 1000, 1001, 1002, 2000, 2001,2002 having the protective layer or/and the reflective layer can emitlight from the light-emitting diode unit toward the substrate which issubstantially defined as a five-surface light-emitting diode unit. Whenthe light-emitting units 11, 13 are merely arranged on the top surface101, 101″ of the carrier 10, 10″ (shown in FIGS. 1A, 3A, 4A˜4F, 6A) andincludes a transparent body 103 having the wavelength conversion layerdispersed in and formed on the light-emitting units 11, 13 and portionof the carrier, portion of the light (ex. blue light) emitted from thelight-emitting unit is converted to another light (ex. yellow oryellowish-green light) by the wavelength conversion layer. The bluelight is mixed with the yellow light (or yellowish-green light) to forma white light. In other embodiment, the light-emitting diode unitincludes a wavelength conversion material for converting the lightemitted by the active layer, thus the transparent body 103 does notincludes the wavelength conversion layer. In this embodiment, thecarrier is a transparent or semi-transparent. Portions of the whitelight can be scattered or reflected by the particles within thewavelength conversion layer (or the wavelength conversion material) tobe incident on the transparent or semi-transparent carrier such that thewhite light not only emits outwardly through a side (top surface) of thetransparent carrier on which the light-emitting unit is arranged, butalso emits outwardly through a side surface and a bottom surface of thetransparent carrier, which indicates the white light can emit outwardlythrough all surfaces of the carrier (defined as a six-surfacelight-emitting device). In addition, a diffusing powder (ex. TiO₂) isoptionally added into the wavelength conversion layer (or the wavelengthconversion material) for increasing the possibility in which the whitelight progresses downward. In short, in this embodiment, anapproximately uniform light distribution (can be seen from a six-surfacelight-emitting device) can be achieved by using a non-uniform lightsource (such as five-surface light-emitting diode). Furthermore, thewhite light at the side of the transparent carrier on which thelight-emitting unit is arranged (top surface) has a first averagecorrelated color temperature (CCT); the white light at another side ofthe transparent carrier (bottom surface) has a second average correlatedcolor temperature less than the first average correlated colortemperature. A difference of the first average correlated colortemperature and the second average correlated color temperature is notsmaller than 50K and not greater than 300K. To be specific, thelight-emitting device is disposed on a black base with the top surfacefacing upward and is electrically connected to the external source. Whenthe light-emitting device emits light, a Chroma Meter (for example,UPRtek, MK350) is used to measure the correlated color temperature toobtain the first average correlated color temperature. Hereinafter, thelight-emitting device is provided with its bottom surface facing upwardand is electrically connected to the external source. When thelight-emitting device emits light, the second average correlated colortemperature is measured. Alternatively, a goniophotometer is used toobtain the correlated color temperature of the white light at any pointin a space. For example, the light-emitting device is viewed as acentral point, and a correlated color temperature spatial distributionof the light emitted from the light-emitting device is shown in FIG. 8E(0°˜360°). The spatial angle at the top surface of the carrier (with thelight-emitting unit) is defined as 0°˜180° and the spatial angle at thebottom surface of the carrier (without the light-emitting unit) isdefined as 180°˜360°. In the range of 0°˜180°, the correlated colortemperature at any angle is measured to obtain a first correlated colortemperature; in the range of 180°˜360°, the correlated color temperatureat any angle is measured to obtain a second correlated colortemperature; the first correlated color temperature is greater than thesecond correlated color temperature and a different of the firstcorrelated color temperature and the second correlated color temperatureis not smaller than 50K and not greater than 300K. As shown in FIG. 8E,within the range of 180°˜360°, the correlated color temperature in therange of 210°˜225° and 315°˜300° is higher. In addition, the averagecorrelated color temperature at the top surface (0°˜180°) is greaterthan that at the bottom surface (180°˜360°).

FIG. 9 illustrates a cross-sectional view of a light-emitting device 400in accordance with another embodiment of the present disclosure. Thelight-emitting device 400 includes a transparent carrier 10″′, aplurality of light-emitting diode units 1004 disposed on the transparentcarrier 10″′, a first electrode pad 201′″ and a second electrode pad202″′. The light-emitting diode unit 1004 includes a substrate 140, afirst-type semiconductor layer 141, an active layer 142 and asecond-type semiconductor layer 143. The first-type semiconductor layer141 and the second-type semiconductor layer 143, for example a claddinglayer or a confinement layer, respectively provide electrons and holessuch that electrons and holes can be combined in the active layer 142 toemit light. The light-emitting diode unit 1004 further includes a firstbonding pad 144 formed on the first-type semiconductor layer 141 and asecond bonding pad 145 formed on the second-type semiconductor layer143. The light-emitting diode unit 1004 includes a reflective structure146 formed between the substrate 140 and the carrier 10″′ for reflectingthe light from the light-emitting diode unit 1004 toward the bondingpad, which is substantially defined as a five-surface light-emittingdiode unit. A wire 147 connects the first bonding pad 144 of onelight-emitting diode unit 1004 with the second bonding pad 145 ofadjacent light-emitting diode unit 1004 in series. Moreover, the wire147 further connects the light-emitting diode unit 1004 with the firstelectrode pad 201″′ and the second electrode pad 202″′. When thelight-emitting device 400 is connected to the external source (powersupply), a positive node and a negative node of the external source iselectrically connected to the first electrode pad 201″′ and the secondelectrode pad 202″′, respectively, such that the light-emitting diodeunit 1004 can emit light. Similarly, since a transparent body 103including a wavelength conversion layer (not shown) can be formed on thelight-emitting diode unit 1004 and portions of the transparent carrier10″′. Portion of the light (ex. blue light) emitted from thelight-emitting diode unit 1004 is converted to another light (ex. yellowor yellowish-green light) by the wavelength conversion layer. The bluelight is mixed with the yellow light (or yellowish-green light) to forma white light. Portions of the white light can be scattered or reflectedby the particles within the wavelength conversion layer to be incidenton the transparent carrier such that the white light not only emitsoutwardly through a side (top surface) of the transparent carrier onwhich the light-emitting unit is arranged, but also emits outwardlythrough side surface and a bottom surface of the transparent carrier,which indicates the white light can emit outwardly through all surfaces(defined as a six-surface light-emitting device). In addition, adiffusing powder (ex. TiO₂) is optionally added into the wavelengthconversion layer (or the wavelength conversion material) for increasingthe possibility in which the white light progresses downward. In short,in this embodiment, an approximately uniform light distribution (can beseen from a six-surface light-emitting device) can be achieved by usinga non-uniform light source (such as five-surface light-emitting diode).In other embodiment, a wavelength conversion material is directly formedon the second-type semiconductor layer 143 for converting the lightemitted by the active layer, thus the transparent body 103 does notincludes the wavelength conversion layer. The reflective layer can be asingle layer or a multilayer structure made of one or more conductivematerial or insulating material. The conductive material includes Ag,Al, Ni. Cu, Au, Ti, or combinations thereof. The insulating materialincludes epoxy, SiO_(x), Al₂O₃, TiO₂, silicone, resin or combinationsthereof.

It is noted that the carrier 10, 10′, or 10″′ is transparent ornon-transparent to the light emitted by the light-emitting units 11,12A, 12B, 13 depending on actual requirements. When the carrier istransparent, it can be glass (n (refractive index)=1.4˜1.7), SiC,diamond, epoxy, quartz, acryl resin, SiO_(x), Al₂O₃, ZnO, silicone orcombinations thereof. The glass can include Soda-Lime Glass, AluminoSilicate Glass, or low alkaline glass. When the carrier isnon-transparent, it can be circuit board with a core board made of ametal, a thermoplastic material, a thermosetting material or a ceramicmaterial. The metal includes Al or Cu. The thermosetting materialincludes phonetic, epoxy, bismaleimide triazine, or combinationsthereof. The thermoplastic material includes polyimide resin, orpolytetrafluorethylene. The ceramic material includes Al₂O₃, MN, orAlSiC. The top electrode and the bottom electrode can include Au, Al,Cu, Ag or combinations thereof. In another embodiment, the carrier ismade of a flexible material such as polyimide. The transparent body 103is transparent or semi-transparent to the light emitted by thelight-emitting units 11, 12A, 12B, 13.

FIG. 10A illustrates a perspective view of an LED bulb 500 in accordancewith an embodiment of the present disclosure. The LED bulb 500 includesa cover 50, a light-emitting device 100, a circuit board 52, a heat sink54, and an electrical connector 56. The light-emitting device 100 can bereplaced by the light-emitting device 200, 300 and the light-emittingdevice 200, 300 can be applied in the light-emitting bulb 500. Thelight-emitting device 100 can be viewed as a light filament. When thelight-emitting device 100 is mounted on the circuit board 52, thecarrier 10 is connected to the circuit board 52 through the same sidebut different surfaces (see FIG. 1C) thereof. Alternatively, by theelectrical plate 25, the external source is connected to the carrier 10at the same surface but at two opposite sides (see FIGS. 6A˜6E). Thecircuit board 52 is mounted on the heat sink 54 for dissipating heatgenerated by the light-emitting device 100 away therefrom in aconduction, convection or radiation method. The electrical connector 56is connected to the heat sink 54, and also connected to the externalsource. In this embodiment, the light-emitting devices are substantiallydisposed on the circuit board 52 in a vertical direction (Z) andarranged in a triangular pattern (from the top view). In otherembodiment, the light-emitting devices can be arranged in a rectangularpattern, a polygonal pattern or an approximate circle pattern. FIG. 10Billustrates a top view of a circuit board on which the light-emittingdevices are mounted in accordance with an embodiment of the presentdisclosure. The light-emitting devices 100 are arranged in aquadrangular pattern while the top surfaces 101 of each carrier (withthe light-emitting units) face outwardly and the bottom surfaces of eachcarrier (without the light-emitting units) face each other. The LED bulb501 further includes a light-emitting unit 15 disposed in an interiorspace defined by the quadrangular pattern and surrounding by thelight-emitting devices 100. The light-emitting unit 15 substantiallyemits light along the Z direction (see FIG. 10A). It is noted that thelight-emitting device 100 emits white light and the light-emitting unit15 emits red light so this configuration can improve the color rendering(CRI≧90) or the Color Quality Scale (CQS≧85). Any one of thelight-emitting diode unit 1000, 1001, 1002, 1003, 2000, 2001, 2002 canbe used as the light-emitting unit 15.

FIG. 11A illustrates a perspective view of an LED bulb 502 in accordancewith another embodiment of the present disclosure. FIG. 11B illustratesa top view of FIG. 11A. The LED bulb 502 is similar with the LED bulb501. The devices, elements or steps with similar or the same symbolsrepresent those with the same or similar functions. The light-emittingdevices 100 are substantially disposed on the circuit board 52 in avertical direction (Z) and arranged in a quadrangular pattern (from thetop view). The light-emitting device 200, 300 can also be applied inthis embodiment. In other embodiment, the light-emitting devices can bearranged in a rectangular pattern, a polygonal pattern or an approximatecircle pattern. Referring to FIG. 11B, the light-emitting devices 100A,100B are arranged along the first direction (A) in a straight line witha width direction parallel with the first direction. The light-emittingdevices 100C, 100D are arranged along the second direction (B) in astraight line with a width direction parallel with the second direction.The first direction is, but not limited to, substantially perpendicularto the second direction. An angle between the first direction and thesecond direction can be 30°, 45° or 60°. Each top surface 101 (with thelight-emitting unit) of the light-emitting units 100A, 100B has a normalvector perpendicular to the first direction (A) and the two normalvectors point in opposite directions from each other (see arrow).Likewise, each top surface 101 (with the light-emitting unit) of thelight-emitting units 100C, 100D has a normal vector perpendicular to thesecond direction (B) and the two normal vectors point in oppositedirections from each other (see the arrow). Furthermore, the emittingdirection (see the arrow) of the light-emitting devices 100A, 100B,100C, 100D can be viewed in a clockwise direction (or anticlockwise).The top surface 101 of the light-emitting device 100A faces the bottomsurface 102 of the light-emitting device 100D. FIG. 11C illustrates atop view of a circuit board on which the light-emitting devices aremounted in accordance with an embodiment of the present disclosure. Itis different from that of FIG. 11B that a light-emitting unit 15 isfurther disposed in a space between two adjacent light-emitting devices100. The light-emitting unit 15 substantially emits light along the Zdirection (see FIG. 10A). It is noted that the light-emitting device 100emits white light and the light-emitting unit 15 emits red light so thisconfiguration can improve the color rendering (CRI≧90) or the ColorQuality Scale (CQS≧85).

FIG. 11D illustrates a perspective view of an LED bulb in accordancewith one embodiment of the present disclosure. The LED bulb includes acover 50, four light-emitting devices 100, a circuit board 52, a heatsink 54, and an electrical connector 56. The detail structure of thelight-emitting device 100 can be referred to the aforesaid embodiments.In this embodiment, the carrier of each of the light-emitting devices100 is made of a flexible material, such as polyimide. The fourlight-emitting devices 100 are alternately arranged over each other onthe circuit board 52. Specifically, the carrier of the bottomlight-emitting device 100E is bent to have an arc shape and the topsurface of the carrier faces outwardly so the light-emitting units 11emit outwardly. Similarly, the carrier of each of the first middlelight-emitting device 100F, the second middle light-emitting device 100Gand the top light-emitting device 100H is bent to have an arc shape andthe top surface of the carrier faces outwardly so the light-emittingunits 11 emit outwardly. By this configuration, light can emit towarddifferent directions such that an LED bulb with an omnidirectionaldirection light pattern can be obtained. FIG. 11E illustrates a top viewof FIG. 11D without the cover 50. Each of the light-emitting devices100E˜100H extends in different directions (for example, the bottomlight-emitting device 100E extends from point 1 to point 2; the toplight-emitting device 100H from point 3 to point 4).

FIG. 11F illustrates a perspective view of an LED bulb in accordancewith one embodiment of the present disclosure. The LED bulb includes acover 50, a post 57, a light-emitting device 100′, a circuit board 58, aheat sink 54, and an electrical connector 56. The light-emitting device100′ includes a flexible carrier 10 and a plurality of light-emittingunits 11 on the carrier 10. In this embodiment, the post 57 is a solidcylinder and has a circuit for electrically connecting to thelight-emitting units 11. Alternatively, the post 57 can be a hollowcylinder. FIG. 11G illustrates the flexible carrier 10 in a non-bendingstate. The flexible carrier 10 has a first portion 107 and a secondportion 108. In this embodiment, a plurality of light-emitting units 11is arranged on the first portion 107 in an array and one light-emittingunit 11 is arranged on the second portion 108. When the flexible carrier10 is attached to the post 57, the first portion 107 is bent to windalong the contour of a side surface of the post 57. Subsequently, thesecond portion 108 is bent in a direction toward a center of the post57. After winding on the post 57, the second portion 108 issubstantially perpendicular to the first portion 107. By thisconfiguration, the light-emitting units 11 on the first portion 107 emitlight toward a side direction and the light-emitting unit 11 on thesecond portion 108 emits light in an upward direction, thereby an LEDbulb with an omnidirectional direction light pattern can be obtained. Inaddition, an enclosing structure 59 is optionally provided to fullyenclose the light-emitting device 100′ and the post 57. The enclosingstructure 59 is transparent and can be made of a material like siliconeor epoxy.

FIG. 11H illustrates a perspective view of an LED bulb in accordancewith one embodiment of the present disclosure. The LED bulb of FIG. 11Hhas a structure similar to that of FIG. 11F. The LED bulb is a type Abulb and includes a cover 50, a pedestal 581, a post 57, alight-emitting device 100″, a heat sink 54, and an electrical connector56. The light-emitting device 100″ includes a flexible carrier 10 and aplurality of light-emitting units 11 on the carrier 10. In thisembodiment, the post 57 is a hollow cylinder and has a circuit forelectrically connecting to the light-emitting units 11. FIG. 11Iillustrates the flexible carrier 10 in a non-bending state. Differentfrom the light-emitting device 100′, the light-emitting device 100″includes four second portions 108 each of which has one light-emittingunit 11 is arranged thereon[??]. By this configuration, thelight-emitting units 11 on the first portion 107 emit light toward aside direction and the light-emitting units 11 on the second portions108 emit light in an upward direction, thereby an LED bulb with anomnidirectional direction light pattern can be obtained.

FIG. 11J illustrates a perspective view of an LED bulb in accordancewith one embodiment of the present disclosure. The LED bulb of FIG. 11Jhas a structure similar to that of FIG. 11H. In this embodiment, the LEDbulb does not include a heat sink and the cover 50 is directly connectedto the electrical connector 56. The LED bulb is also the light-emittingbulb with an omnidirectional direction light pattern. It is noted thatthe aforesaid “omnidirectional direction light pattern” means the lightpattern complying with the definition by Energy Star.

FIG. 12 illustrates a cross-sectional view of a light-emitting tube inaccordance with one embodiment of the present disclosure. Thelight-emitting tube includes a light-emitting device, a holder 80 and acover 81. The aforesaid light-emitting devices can be combined with eachother to apply in this light-emitting tube. In another embodiment, thecover 81 can be made of a flexible material such as polyimide (PI). Inthis embodiment, taking the light-emitting device of FIGS. 4A and 4B forexample, the holder 80 includes a first clamp portion 801, a secondclamp portion 802, and a penetrating hole 803. The first clamp portion801 and the second clamp portion 802 are spaced apart from each otherand define a space therebetween. The light-emitting device has a partpassing through the space and further through the penetrating hole 803to expose the top electrode pad 201 and the bottom electrode pad 301 forelectrically connecting to the external source. With the clamp portions801, 802 tightly clamping the light-emitting device, the light-emittingdevice can be mounted on the holder 80. In another embodiment, the spacebetween the clamp portions 801, 802 is larger than a width of thelight-emitting device and does not directly contact the light-emittingdevice so an adhesive substance (not shown) is filled within the spacebetween the clamp portions 801, 802 for firmly mounting thelight-emitting device on the holder. The holder 82 substantially dividesthe light-emitting device into two sides wherein one is with thelight-emitting units 11 and the other is with the top electrode pad 201and the bottom electrode pad 301. The cover 81 merely covers the sidewith light-emitting units 11 but does not cover the side with topelectrode pad 201 and the bottom electrode pad 301. In addition, thecover 81 is spaced apart from the light-emitting device by a shortestdistance (d2) smaller than 2 mm for efficiently dissipating heat fromthe light-emitting device to ambient (air) through the cover.Alternatively, a filler can be filled between the cover 81 and thelight-emitting device and includes a transparent substance, a wavelengthconversion layer or a diffusing layer (not shown). The filler directlycontact the light-emitting device for conducting heat from thelight-emitting device to ambient (air) therethrough. Moreover, becauseof the filler, the light-emitting device has a better hot/cold ratio. Tobe more specific, when the light-emitting device is connected to theexternal source, in an initial state, a cold-state lighting efficiency(light output (lumen)/watt) is measured, hereinafter, in every period oftime (ex. 30 ms), the lighting efficiency is measured. When a differencebetween the adjacent measured light emitting efficiencies is smallerthan 0.5%, the latter light efficiency is defined as a hot-statelighting efficiency. The hot/cold ratio is a ratio of the hot-statelighting efficiency to the cold-state lighting efficiency. In thisembodiment, when the filler is filled between the light-emitting deviceand the cover, the hot/cold ratio of the light-emitting device is R₁,and when the filler is not filled between the light-emitting device andthe cover, the hot/cold ratio of the light-emitting device is R₂,wherein a difference of R₁ and R₂ is larger than 20%. The adhesivesubstance can be made of a material the same as the transparentsubstance. The cover 81 includes diamond, glass, epoxy, quartz, acrylicresin, SiO_(x), Al₂O₃, ZnO or silicone. The transparent substanceincludes silicone, epoxy, polyimide (PI), BCB, perfluorocyclobutane(PFCB), SUB, acrylic resin, polymethyl methacrylate (PMMA), polyethyleneterephthalate (PET), polycarbonate (PC), polyetherimide, fluorocarbonpolymer, Al₂O₃, SINR, spin-on-glass (SOG).

FIGS. 12A˜12C illustrate drawings of a method making the light-emittingtube of FIG. 12. Referring to FIG. 12A, a carrier 10 is provided and aplurality of light-emitting units 11 disposed on the top surface 101 andthe bottom surface 102 of the carrier 10 to form a light-emittingdevice. Referring to FIG. 12B, a hollow cover 81 is provided and has anopen end and a closed end. A transparent substance 811 (which caninclude a wavelength conversion material and/or a diffusing powder) isfilled into the cover 81 from the open end. Referring to FIG. 12C, aportion of the light-emitting device is embedded into the transparentsubstance 811 such that the top electrode pad 201 and the bottomelectrode pad 301 are exposed from the open end. It is noted that, inthe embedded step, gas (air, bubble) may be generated, and a degas stepcan be performed to remove the gas. Alternatively, the gas is notentirely removed so there is gas existing in the transparent substance811. Subsequently, the transparent substance 811 can be solidified byheating or lighting. Optionally, before the solidification, a holder isprovided and the light-emitting device passes through the penetratinghole of the holder and is mounted on the holder (as shown in FIG. 12)such that the side with the light-emitting units is fully sealed by thecover to expose the top electrode pad 201 and the bottom electrode pad301 for electrically connecting to the external source.

FIGS. 13A˜13D illustrate drawings of a method making the light-emittingdevice 600 in accordance with one embodiment of the present disclosure.The light-emitting device 600 is similar with the light-emitting device100. The devices, elements or steps with similar or the same symbolsrepresent those with the same or similar functions. Referring to FIG.13A and FIG. 13B, a carrier 10 is provided and the top electrode 20, thebottom electrode 30 and a temporary electrode 220 are formed on thecarrier 10 using printing. A hole 221 is formed and a conductivematerial is fully or partly filled with the hole 221 for electricallyconnecting the top electrode 20 with the bottom electrode 30. Thetemporary electrode 220 can be electrically connected to the topelectrode 20. Furthermore, a scribe line 222 is formed on the bottomsurface 102 of the carrier at a position corresponding to the temporaryelectrode 220. The light-emitting units 11 are mounted on the topelectrode 20 (or/and the bottom electrode, as shown in FIG. 5A) of thecarrier 10 by surface mounted technology or wiring bonding. Referring toFIGS. 13C and 13D, a first transparent layer 1032 is formed to cover thelight-emitting units 11 along its contour; a wavelength conversion layer1033 is formed to cover the first transparent layer 1032 along itscontour; and a second transparent layer 1034 is formed to cover thewavelength conversion layer 1033 without having the same contour as thewavelength conversion layer 1033. During test, the positive node and thenegative node of the external source are connected to the top electrode20 and the temporary electrode 220, respectively, so the light-emittingunits 11 emit light. Hereinafter, the temporary electrode 220 andportions of the carrier 10 are removed along the scribe line 222. Inthis embodiment, the temporary electrode 220 is removed using breaking,laser dicing, or diamond dicing that such methods can cause a side 121of the carrier 10 with a rough, unsmooth, or irregular surface. On thecontrary, another side 122 of the carrier has a smooth surface.Therefore, the side 121 and another side 122 have different roughness.The wavelength conversion layer can be a single layer or a multilayerstructure. FIG. 13E is a cross-sectional view of FIG. 13D (along Xdirection). The light-emitting unit 11 has a height (H₂), a maximumdistance between the second transparent layer 1034 and the carrier isH₁; H₂≧0.5H₁. It is noted that when the light-emitting unit 11 includesthe first transparent structure (the light-emitting diode units 2000,2001 or 2002 in FIG. 8A, FIG. 8B to FIG. 8D), and the first transparentstructure 7026 is made of a material the same as the first transparentlayer 1032, an interface formed therebetween is vague under theelectrical microscopy or the interface does not exist between the firsttransparent structure 7026 and the first transparent layer 1032.

While the aforesaid light-emitting device is applied in an alternatingcurrent (AC) power supply or a direct current (DC) power supply with aroot mean square voltage of 120V, the light-emitting device can bedesigned to have an operating voltage of 140V±10%; while thelight-emitting device is applied in an alternating current (AC) powersupply or a direct current (DC) power supply with a root mean squarevoltage of 100V, the light-emitting device can be designed to have anoperating voltage of 115V±10%; while the light-emitting device issupplied with an alternating current (AC) power supply or a directcurrent (DC) power supply with a root mean square voltage of 220V, thelight-emitting device can be designed to have an operating voltage of280V±10%. The alternating current (AC) power supply is rectified to adirect current (DC) power supply. Furthermore, the light-emitting devicecan also be supplied with a direct current power supply with asubstantially constant voltage (ex. battery) and the light-emittingdevice can be designed to have an operating voltage smaller than 15V. Inaddition, a plurality of light-emitting devices is disposed in a supportand the light-emitting devices are electrically connected to each otherin series, in parallel, in series-parallel for increasing theapplications. Moreover, the aforesaid light-emitting device or lighttube can also be applied in U-shape lamp, spiral lamp, bulb, and candlelamp.

It is noted that, besides the light-emitting diode unit (FIGS. 7A˜7D,8A˜8B and 8D) described in the present disclosure can be used as any oneof the light-emitting units. However, the conventional package structure(for example, 3014 or 5630 package) can be used as any one of thelight-emitting units.

It is noted that the foregoing description has been directed to thespecific embodiments of this invention. It will be apparent to thosehaving ordinary skill in the art that other alternatives andmodifications can be made to the devices in accordance with the presentdisclosure without departing from the scope or spirit of the disclosure.In view of the foregoing, it is intended that the present disclosurecovers modifications and variations of this disclosure provided theyfall within the scope of the following claims and their equivalents.

What is claimed is:
 1. A light-emitting bulb, comprising: a cover; anelectrical associated with the cover; a board arranged between the coverand the electrical connector; and a first light-emitting device disposedon the board and comprising: a carrier having a first side and a secondside; a first electrode part disposed near the first side and extendingto the second side; a bended part disposed near to the second side andspaced apart from the first electrode part; and a second electrode partextending from the bended part to the first side; wherein nolight-emitting diode unit is arranged on the second electrode part. 2.The light-emitting bulb of claim 1, wherein the carrier has a surface onwhich the first electrode part and the second electrode part are formed.3. The light-emitting bulb of claim 2, further comprising a firstelectrode pad formed on the surface and connected to the first electrodepart.
 4. The light-emitting bulb of claim 3, further comprising a secondelectrode pad formed on the surface and connected to the secondelectrode part.
 5. The light-emitting bulb of claim 4, wherein the firstelectrode pad and the second electrode pad are at the first side.
 6. Thelight-emitting bulb of claim 1, wherein the second electrode part is astraight line.
 7. The light-emitting bulb of claim 1, wherein the secondelectrode part is parallel to the first electrode part.
 8. Thelight-emitting bulb of claim 1, wherein the light-emitting devicefurther comprises a plurality of light-emitting units formed between thefirst electrode part and the bended part.
 9. The light-emitting bulb ofclaim 1, wherein the light-emitting device further comprises atransparent body covering the plurality of light-emitting units.
 10. Thelight-emitting bulb of claim 9, wherein the transparent body covers thefirst electrode part and the second electrode part.
 11. Thelight-emitting bulb of claim 1, wherein the second electrode part has alength greater than the first electrode part.
 12. The light-emittingbulb of claim 1, further comprising a plurality of light-emittingdevices arranged in a triangular pattern, a rectangular pattern, apolygonal pattern or an approximate circle pattern from the top view.13. The light-emitting bulb of claim 1, wherein the light-emittingdevice is substantially disposed on the board in a vertical direction.14. The light-emitting bulb of claim 1, further comprising a secondlight-emitting device having a carrier, wherein each of the carriers ofthe first light-emitting device and the second light-emitting device hasa top surface with a normal vector, and the two normal vectors point inopposite directions from each other.